{
  "kind": "合成对照输入与本地模型/解析结果，非设备实测",
  "article": "https://qifudev.com/article/ldo-copper-area-theta-ja/",
  "tool": "https://qifudev.com/tools/ldo-thermal/",
  "model": "Pd=(Vin−Vout)Iout+Vin×Ig；Tj≈Ta+Pd×θJA",
  "inputs": {
    "vin": "5",
    "vout": "3.3",
    "current": "0.3",
    "groundMa": "1",
    "theta": "150",
    "ambient": "40"
  },
  "outputs": {
    "loss": 0.515,
    "junction": 117.25,
    "efficiency": 65.78073089700996
  },
  "extra_checks": [],
  "warnings": [
    "θJA取决于PCB、铜面积和气流，结温只是给定热阻下的稳态估算，不验证瞬态或压差能力。"
  ],
  "limitation": "不验证压差、输出稳定性和瞬态温升；温度为假设热阻下预测，不能代替板级热测。",
  "source": {
    "label": "TI：LDO热阻现场测量",
    "url": "https://www.ti.com/lit/an/slva422a/slva422a.pdf"
  },
  "measured": {
    "device": null,
    "firmware": null,
    "instrument": null,
    "conditions": null,
    "raw_result": null,
    "verdict": null
  }
}